Single-Wafer Nassätzanlage

Fraunhofer IMS requires a new or refurbished fully automated spin-etching-tool. In this system, 8” (200 mm) wafers can be processed according to the specifications below. The system has to include the following modules: — an automation module for wafer handling, — a silicon wet-etching-chamber with an appropriable spin etch process (see specification document), — a spin-rinse-dry-chamber, — a measurement station for determination of wafer thickness or silicon film thickness pre and post etching (see specification document), — application software which offers the option of configuration of operating, engineering and maintenance mode.