ECD Tool.

This document defines all Fraunhofer IZM-ASSID requirements and acceptance criteria for deposition equipment with different options (electro chemical deposition equipment (ECD) and e-less deposition) which must be achieved during start-up and warranty period. These criteria are designed to demonstrate the capability of the processing equipment to fulfil the requirements for metal plating of high aspect ratio bumps, Redistribution Layers, copper filling of high aspect ratio trough silicon via (TSV) and glass surfaces as well as other layers for advanced packaging applications, interposer and CMOS application using 200 mm and 300 mm bulk silicon, glass and SOI wafers. Electro chemical deposition for Bump and RDL applications plus two options are requested: ECD for TSV applications, and/or E-less deposition applications.