Cluster Tool for Nanomaterials

The planned acquisition comprises a cleanroom compatible cluster tool for sputter deposition and rapid thermal annealing of composite films and multilayers stacks for nanotechnological devices on 200 mm substrates. The main application of the tool is concentrated on film based nanotechologies with a special focus on metal-oxide based devices. The tool should consist of a central handling module, a magazine load lock and two process chambers, which allows the single wafer handling between the process chambers without vacuum break. For the sputter chamber intended materials are metals, e.g. Al, metal oxides and nitrides, e.g. TiO2, Ta2O5, TiN, perovskites, e.g. BiFeO3, YMnO3, semiconductors, e.g. Si, Ge, IGZO, as well as piezoelectric materials for NEMS, e.g. AlN. Therefore, a confocal sputter source arrangement of at least 3 sources in combination with a rotating substrate are necessary. The substrate table should have a heating functionality up to 600 oC with an allowed temperature