Automatischer Waferprober

Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or under controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least 2 cassettes. The whole system contains at least 1 cleaning module, 1 plasma activation module, 1 fully automated bond aligner, 1 bond chamber and a wafer handling system. Further specifications for each module are given below. The wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.