ALS-System

Fraunhofer ISIT plans to purchase an atomic layer deposition (ALD) system for a novel MEMS technology. The basic procedure is illustrated in the figure below. A mold pattern, created within a substrate for example by dry etching, is filled with loose micron-sized particles. Then the substrate is subjected to an ALD process. With optimized process conditions the initially loose particles are glued (agglomerated) at the points of contact to a rigid porous 3D structure over the whole mold depth by an ALD layer with a thickness of several tens of nanometers. The feasibility of the novel technology has already been proven for different applications using particles from various materials. The new ALD tool should enable the next steps towards industrialization.